CYBERSOLV C8882 is a solvent-based stencil cleaning fluid specifically designed to clean solder paste, uncured SMT adhesive and flux residue from stencils, mis-printed PCBs, stencil tools and printing squeegees. C8882 can be used in automated understencil wipe processes, hand-wipe, and ultrasonic cleaning systems as well as spray systems designed for solvent.
CYBERSOLV C8882 has a mild solvent odor, quickly dissolves all flux constituents within the solder paste and will not adversely affect stencils that have been nano-coated. C8882 has been proven compatible with all wetted components in automated understencil wipe systems and approved for use by several printer manufactures’. CYBERSOLV C8882 is fast drying without leaving behind any residue.
Features
- Removes All Flux Types
- Fast Drying
- Non-Flammable
- Does Not Interact or Remove Nano-Coatings
Product Data
- Type: PCB Stencil Cleaning Chemistry
- Process: Understencil, Hand-held Ultrasonic Cleaner & Manual
- Concentration: 100%
- Temperature: Ambient
- Rinse: Optional
- Dry: Air
- pH (10g/L): N/A (Solvent-Based)
- Flash Point: 142 °F / 61 °C
- Boiling Point: 270°F / 132°C
- Water Soluble: Partial
- VOC, @ 100% 875.6 g/L
Environmental Regulations
CYBERSOLV® C8882 is a non-flammable, non-corrosive organic solvent solution. It contains no CFC's or HAP's.
Availability
Available in 1, 5, and 55 gallon (5, 25, 200 liters) containers.
Compatibility
Cybersolv® C8882 is compatible with all materials commonly used in electronic assembly manufacturing and cleaning processes.Storage and Handling
- Packaged in Polyethylene Containers
- Store at 5-30°C/41-86°F in Original Container
- Standard Chemical Handling Practices Required
- Shelf Life of 5 Years, in Sealed Containers of 5 gallons / 25 liters or More
