AQUANOX A4651US is a low pH cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems. A4651US reduces the cavitation threshold, will completely remove flux residues from printed circuit assemblies and is compatible with a variety of metal components and substrates including aluminum and copper. AQUANOX A4651US cleans most lead-free, no-clean, rosin-based, and water-soluble flux residues consistently on assemblies.
AQUANOX A4651US provides bright and shiny solder joints with no sump side additives and cleans exceptionally well on the latest flux formulations. A4651US can be used “as-is” or diluted, dependent on the flux type. AQUANOX A4651US consistently and successfully provides exceptional cleaning results with minimal bath monitoring.
Features:
- Effective on All Flux Types
- Produces Mirrored Solder Joints
- Consistent Successful Cleaning Results with Minimal Bath Monitoring
- Multi Metal Safe including Aluminum and Copper
- Easy to use with a Low pH
Specs:
- Application: PCB Cleaning
- Process: Ultrasonic
- Concentration: SnPb Alloys ≤25%; Pb-Free Alloys ≤30%
- Temperature: <150°F / 66°C
- Rinse: Hot DI Water
- Dry: Hot Air
- pH (10g/L): 9.7
- Flash Point: None to Boiling
- Boiling Point: 210°F / 99°C
- Water Soluble: Complete
- VOC, @ 10% 46.7 g/L
Environmental Regulations
AQUANOX A4651US is a biodegradable aqueous solution. It contains no CFC's or HAP's
Availability
Available in 1, 5, and 55 gallon (5, 25, 200 liters) containers.
Storage and Handling
- Packaged in Polyethylene Containers
- Store at 5-30°C/41-86°F in Original Container
- Standard Chemical Handling Practices Required
- Shelf Life of 5 Years, in Sealed Containers of 5 gallons / 25 liters or More
