Produced using the same chemical composition as the solder alloy marketed as SN100C® by Nihon Superior Sha Co., Ltd. and its licensees*, NT100Ge is a high-quality, low-cost alternative to silver-bearing solder. The eutectic tin-copper-nickel alloy creates a shiny, smooth, robust interconnect for a wide range of electronics assembly requirements. With a melting temperature of 441°F, NT100Ge is compatible with all wave and selective solder equipment. Similar to the effect of phosphorous in Sn63 alloys, the small addition of Germanium in NT100Ge serves as a de-oxidant, which keeps drossing to a minimum. For PCB fabrication applications such as the hot air solder leveling (HASL) process during which copper levels increase, NT100GeX provides a low-copper solder solution.
NT100Ge can be used as a drop-in replacement for any existing 99C or SN100C solder bath, without the need for pot dumps or swaps.