Wave Soldering Flux, Selective Soldering Flux JS-EU-01

No-Clean Wave Soldering Flux / Selective Soldering Flux for Leaded and Lead-Free Assembly

JS-EU-01 is made by special preparation which doesn't use rosin at all, realizing a beautiful finish where flux residue after soldering is hardly visible. Minimizing outflow of solid content due to the heat and pressure of waving, the rosin-free flux remains active until the end of the process. Realizes amazingly consistent solder workability.

• New low solids formulation drastically REDUECES bridging, blow holes and solder balling.
• Significant IMPROVEMENT in through hole filling with OSP boards.
• Extremely LOW residue despite a powerful soldering action.

Excellent workability even with long dipping

By minimizing outflow of solid content due to the heat and pressure of waving, the rosin-free flux remains active until the end of the process. Realizes amazingly consistent solder workability.

High soldering quality

Thanks to the newly blended vehicle with excellent wettability on metal surfaces, it has achieved a thin and uniform flux layer. Excellent wettability is realized by removing the OSP/Oxide film on the board pad in the preheating stage, securely prevention re-oxidization, and promptly spreading the active ingredients of the flux over the interface with the molten solder.

JS-EU-01 is made by special preparation which doesn't use rosin at all, realizing a beautiful finish where flux residue after soldering is hardly visible.

Excellent total balance

As far as a solution of the faulty soldering problem is concerned, the skewed improvement of a single characteristic ould rather break down the balance of the entire products, and lower performance consequently.

JS-EU-01 is an excellent product in total balance without biases toward certain characteristics, reflecting improvement on existing products in each category which affects the soldering performance of any board and components.

New technology drastically reduces ball generation!

• Many solder balls are generated on the soldering surface because of the characteristics of lead-free solder, such as inferior solder wettability and cutoff punctuality.
• The balls cause a decline in the direct first time pass rate, or an increase in cleaning and adjustment costs.
• A trigger for ball generation may be ill-balanced flux fluidity and the solder wetting speed.

Through-hole fill property

• Since the melting point of lead free solder is relatively higher than that of Sn/Pb solder, the fluidity of the solder deteriorates, as does the through-hole fill property decline significantly because of the high surface tension and the inferior solder wetting and spreading properties of the alloy.
• JS-EU-01 is a well balanced composition of various active materials to improve solder setting, and also enables fast and sure solder wetting by evenly providing enough sustained activity materials with positive “wetting of flux over the molten solder and pad interface” realized by the new blended flux vehicle “capable of evenly wetting thinly over the metal surfaces at ambient temperature and soldering temperature.

Wave Soldering Flux / Selective Soldering Flux JS-EU-01 Specs