Low Melting Point Lead Free Solder Paste
- Low melting point (138ºC)
- Solder alloy composition is Sn0.4Ag57.6Bi
- PERFECT MELTING and wetting at super fine pitch (>0.4mm pitch) and micro components (>0.3mm dia CSP, 0603 chip).
- Specially formulated flux chemistry ensures extremely LOW VOIDING with CSPs and broad contact area components.
- Conforms to Halogen-free standard (Cl+Br = Less than 1500ppm) BS EN14582
