Type-4 No-Clean Low Voiding Leaded Sn62/Pb36/Ag2 Solder Paste
- Employment of rigidly classified 20-38 micron solder powder ensures outstanding continual printing with fine pitch (0.5mm/20mil) and even super fine pitch (0.4mm/16mil) application and long stencil idle time.
- Conforms to Bellcore tests (Copper Mirror, Halides, Surface Insulation Resistance, Electro migration) GR-78-CORE, Issue 1.
- Extremely long stencil idle time and tack time offers a wide process window.
- Uses carefully classified solder powder with uniform particle size.
- Carefully selected flux chemistry ensures low voids formation.
- Low color flux residue offers superior cosmetic appearance.
- Superior workability, solderability and electrical reliability.
- Applicable for super fine pitch SMT.
Printability
Wettability
Voiding property (PwTr)
SS58-955LV Leaded Solder Paste Specs
| Product Name | SS58-955LV Leaded Solder Paste |
| Product Category | Solder Paste |
| Composition | Sn62, Pb36, Ag2 |
| Melting Point(℃) | 179-190 |
| Particle Size（μm） | 20 – 45 |
| Viscosity（Pa.s） | 200 ± 10% |
| Flux Content(%) | 10 ± 0.5 |
| Halide content(%) | 0 |
| Flux Type | ROL0 |
| Copper plate corrosion | Passed |
| Tack time | >36 hours |
| Shelf life (below 10°C) | >6 months |
