Type-4 No-Clean Halogen Free Lead-Free SAC305 Solder Paste. The Definitive Solder Paste
The S3X58-HF1100-3 by KOKI Company Ltd. is a halogen-free and lead-free solder paste. It features a no-clean flux type, Sn3.0Ag0.5Cu alloy composition, and a particle size of 20-38/10-25um. The solder paste has a melting point range of 217 to 219 Degrees C. It comes in a jar package and the flux content is 11-12%. The S3X58-HF1100-3 has a ROL0 flux type and viscosity of 190 Pa.s. Its flux formulation enhances coagulation during melting, reducing voiding rate, and flux splattering and improves wetting.
Type 4 No Clean Solder Paste Solution for Just About All Soldering Requirements
S3X58-HF1100-3, by adopting newly developed techniques through our expertise and experiences, has gained excellent results in all soldering features such as wetting, flux splattering, voiding, printing, tackiness, electrical reliability, halogen free, etc.
Powerful Wetting Technique Advances Solder Joint Reliability
S3X58-HF1100-3 has applied a newly engineered flux technology in which solder particles are protected from being oxidized by an easy-to-remove protective layer and the antioxidant in the flux suppresses continued oxidation over time.
Such effects help save the amount of activator needed for oxidation prevention, as well as the activator capping technique which allows maximum activation strength when the solder is molten.
Flux Coagulation Technique Improves First Pass Yield
The flux formulation of S3X58-HF1100-3 type 4 no clean solder paste is specifically designed to exhibit enhanced flux coagulation at the time when the solder starts to melt.Instant coagulation and evacuation of the liquified flux when the solder gets molten, brings about various benefits in soldering performance such as reduction in voiding rate and flux splattering, and improved wetting.
Low Voiding
Newly designed flux coagulation technique enables consistently low voiding achieved with each component type and surface finish.
Halogen Free Solder Paste Specs
| Product Name | S3X58-HF1100-3 / S3X70-HF1100-3 Type 4 No Clean Solder Paste |
| Product Category | Solder Paste |
| Composition | Sn 3.0Ag 0.5Cu |
| Melting Point(℃) | 217-219 |
| Particle Size（μm） | 20 - 38 / 10 - 25 |
| Viscosity（Pa.s） | 190 ± 30 |
| Flux Content(%) | 11.7 ± 1.0 / 12.0 ± 1.0 |
| Halide content(%) | 0 |
| Flux Type | ROL0（IPC J-STD-004B and 004C） |
