High Reliability Alloy Solder Paste SAC305 Type-4 No-Clean
High Reliability Lead-Free SAC305 Solder Paste -Excellent Durability Against Heat Cycle Stress
Ideal for extreme environments
SAC type solder joint cannot comply with longer product life requirement for such application that are exposed to significant higher temperatures. To make a much stronger, fatigue resistant joint possible, solid solution strengthening of Sn crystal lattice is facilitated by addition of In and Bi.
Recommended for ENIG finish
In ENIG finish, Sn-Ni IMC layer thickens and along with concentration of P causes the joint interface brittle.By adding Ni-compatible Cu, SB6NX forms a Ni barrier layer and effectively prevents the thickening of Sn-Ni IMC layer, realizing high joint reliability with ENIG finish.
High Reliability Alloy Solder Paste SAC305 For better joint reliability
In comparison with SAC305, SB6NX has better elongation property and is less prone to deformation. That helps to prevent propagation of crack at the solder joint in thermal cycling. As found below, SB6NX shows much higher sheer strength than SAC305 with ENIG and OSP substrate alike.
High Reliability Alloy Solder Paste For ENIG Specs
| Product Name | SB6NX58-M500SI High Reliability Alloy Solder Paste Recommended For ENIG |
| Product Category | Solder Paste |
| Composition | Sn 3.5Ag 0.5Bi 6.0In 0.8Cu |
| Melting Point(℃) | 202 - 204 |
| Particle Size（μm） | 20-38 |
| Viscosity（Pa.s） | 200 / 120( for Dispense) |
| Flux Content(%) | 11.0 / 13.0( for Dispense) |
| Halide content(%) | 0 |
| Flux Type | ROL0 (IPC J-STD-004A) |
| Characteristics | for Dispense：SB6NX58-M500SID |
