Type-4 No-Clean Powerful Wetting Lead-Free SAC305 Solder Paste
Good and Consistent Wetting Spreading to Oxidized Metal Surface
Activator Technique
After removal of oxide film at pre-heating stage, a new protective film formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.
Low Voiding Technique
Solder Spreading Property
After continual print, pause 45 min. or 60 min. and resume printing and observe print volume.
Test condition
- Stencil: 200μm / 6.5mmφ aperture
- Pre-conditioning: 150ºC for 16Hr
- Heat source: Convection reflow
- Reflow: Air
General Purpose, Lead-Free SAC305 Solder Paste S3X58-M500C-7 Specs
| Product Name | General Purpose, Lead-Free SAC305 Solder Paste S3X58-M500C-7 |
| Product Category | Solder Paste |
| Composition | Sn 3.0Ag 0.5Cu |
| Particle Size（μm） | 20-38 |
| Flux Content(%) | 11.8 |
| Flux Type | ROL0 (IPC J-STD-004) |
| Melting Point(℃) | 217-219 |
| Viscosity（Pa.s） | 200 |
| Halide content(%) | 0 |
| Optical Powder Size（μm） | 0 |
