Type-4 No-Clean Halogen Free Solder Paste - Lead-Free SAC305 ICT Solder Paste
Good inspection properties
S3X58-M650-7 halogen free solder paste prevents the buildup of thick and sticky flux residue over the solder joint, which helps the testing probe to get the accurate readings to improve the first pass rate.
Superior wetting ability prevents voiding
For smaller components such as QFNs, micro BGA and LGA, bigger voids could occupy majority of the pad area thus creating a possible weak link for failure. S3X58-M650-7 has specially designed flux to effectively reduce the amount of gas generated thereby minimize the amount of voids.
"Halogen-free" – addressing the environment
One keyword of environmental measures is "halogen-free"; these days companies demand final products to be halogen-free. Halogen-free S3X58-M650-7 meets such demands while providing both reliability and workability.
Halogen Free Solder Paste Product Performance Table
| Composition | Sn 3.0Ag 0.5Cu |
| Composition | Sn 3.0Ag 0.5Cu |
| Melting Point(℃) | 217-219 |
| Particle Size（μm） | 20-38 |
| Viscosity（Pa.s） | 200 |
| Flux Content(%) | 11.5 |
| Halide content(%) | 0 |
| Flux Type | ROL0 (IPC J-STD-004B) |
