Low Voiding Leaded Sn63/Pb37 Solder Paste SE58-M955LV – 500 gm

$89.23
You save

Purchase this product now and earn 9 Points!
x
Brand: Koki Solder
SKU: SE58-M955LV - 500 gm
Availability:

In stock items ship within 24 hours, typically same day. Out of stock Items typically ship in less than 2 weeks. Contact CustomerService@PCBASupplies.com with questions.

Categories: ,

Brand:

Type-4 No-Clean Low Voiding Leaded Sn63/Pb37 Solder Paste

  • Employment of rigidly classified 20-38 micron solder powder ensures outstanding continual printing with fine pitch (0.5mm/20mil) and even super fine pitch (0.4mm/16mil) application and long stencil idle time.
  • Carefully selected flux chemistry ensures low voids formation.
  • Extremely long stencil idle time and tack time offers a wide process window
  • Low color flux residue offers superior cosmetic appearance.
  • Conforms to Bellcore tests (Copper Mirror, Halides, Surface Insulation Resistance, Electro migration) GR-78-CORE, Issue 1.
  • Uses carefully classified solder powder with uniform particle size.
  • Superior workability, solderability and electrical reliability.
  • Applicable for super fine pitch SMT production.

Printability

Sharp print definition

Wettability

Excellent wetting

Voiding property (PwTr)

SE58-M955LV vs. Conventional
SE58-M955LV Leaded Solder Paste Specs
Product Name SE58-M955LV Leaded Solder Paste
Product Category Solder Paste
Composition Sn63, Pb37
Melting Point(℃) 183
Particle Size(μm) 20 – 38
Viscosity(Pa.s) 200 ± 10%
Flux Content(%) 10 ± 0.5
Halide content(%) 0
Flux Type ROL0
Copper plate corrosion Passed
Tack time >48 hours
Shelf life (below 10°C) >6 months