Water Soluble Lead-Free SAC305 Solder Paste Type-4
- Flux residue can be cleaned using pure water or water-based cleaning agents.
- There is little change in characteristics during continuous use, allowing for stable mounting.
- Maintains good print shape without bridging even after repeated printing.
Advantages of pure water and water-based cleaning agents
Due to recent environmental regulations, the selection method for cleaning solutions and equipment has changed, and non-aqueous and semi-aqueous cleaning agents require equipment that complies with each country's emission regulations.
Although water-based cleaning agents are costly to install, they have the following advantages:
- Non-flammable and highly safe.
- Do not require storage in hazardous materials warehouses.
- Have low running costs.
- Produce little waste liquid and are environmentally friendly.
Solve storage concerns
Conventional water-soluble fluxes have poor shape retention because they must be composed of limited water-soluble components, and there is a concern that the components will separate over time and cause printing defects if printed repeatedly.
S3X58-HF950W strengthens the gelling agent network and prevents separation of components. It has improved stability during storage and use, and has achieved workability similar to rosin-based solder paste.
A new approach to poorly soluble substances
Solder paste contains a variety of active ingredients to help melt the solder, but these can sometimes form metal salts that can interfere with cleaning.
S3X58-HF950W uses a new active ingredient that is sufficiently effective in small amounts to melt the solder without compromising its cleanability, reducing the generation of metal salts.
It has also been designed to exhibit good cleaning performance by incorporating the generated metal salts into water-soluble components and cleaning them together.
High cleaning performance
The new flux design overcomes the problems faced by conventional water-soluble solder pastes and makes it possible to wash flux residue with water.
Application example of substrate cleaning
S3X58-HF950W is a halogen-free product that achieves both cleaning and workability. To ensure high mounting quality, it can be used on a wide range of product boards.
- Semiconductors, electronic components
- Automotive, industrial equipment
- Medical and defense related products
- Products using underfill agents and coating agents
Water-Soluble Solder Paste S3X58-HF950W Specs
Product Name | Water-Soluble Solder Paste S3X58-HF950W |
Product Category | Solder Paste |
Composition | Sn 3.0Ag 0.5Cu |
Melting Point(℃) | 217-219 |
Particle Size(μm) | 20-38 |
Viscosity(Pa.s) | 180 |
Flux Content(%) | 11.4 |
Halide content(%) | 0 |
Flux Type | ORH0 (IPC J-STD-004C) |